Automotive Electronics X-ray Services

The Automotive Electronics X-ray Services machine is primarily utilized for the inspection of Surface Mount Technology (SMT), Light Emitting Diodes (LED), Ball Grid Arrays (BGA), and Chip Scale Packages (CSP). Additionally, it facilitates specialized inspection for semiconductors, packaging components, the lithium electronics sector, electronic components, and automotive parts.

Defect Types Detected by X-ray Inspection

X-ray inspection is an effective method for identifying a range of defects in PCB assemblies, including:

Solder Defects
- Insufficient or excessive solder
- Solder voids
- Bridging beneath components
- Head-in-pillow occurrences
- Misalignment of BGA balls

Component Issues
- Missing or incorrect components
- Displaced component positions
- Skewed components
- Inaccurate insertion depths

PCB Defects
- Pad cratering
- Lifted pads
- Plating voids
- Separation of inner layers
- Buried broken traces

Foreign Objects
- Debris trapped within the board
- Metallic contamination

Our X-ray inspection capabilities ensure high-quality results and reliability in identifying these critical defects, enhancing the overall integrity of your PCB assemblies.